| Sign In | Join Free | My futurenowinc.com |
|
Model Number : PCBA-172
Place of Origin : Guangdong, China
Brand Name : XZH
Price : $1.00/pieces >=1 pieces
Type : motherboard pcba
Supplier Type : Customized
Copper Thickness : 1 oz
Layers : 1-58 layers
Certificate : ISO TS16949
Surface treatment : HASL, HASL LF, etc.
Solder mask : Double -sided green LPI/ customized
File needed : Gerber.etc
Application : electronic devices
Material : FR-4 / High TG FR-4 / Halogen Free.etc
Service : Offer PCBA design


| Layers | 1-58 layers |
| Board material | FR-4 / High TG FR-4 / Halogen Free material/Rogers/Arlon/Taconic/Teflon |
| Surface treatment | HASL, HASL lead free, Immersion Gold, Immersion Tin, r, Hard gold, Flash gold, OSP… |
| Silk screen colour | White / Black / Yellow |
| Solder mask colour | Green / Blue / Red / Black / Yellow / White |


| Description | Technology & Capabilities | | | | | ||||
| 1. Product Range | Rigid PCBs from 2- 24 layers, HDI; Aluminium base | | | | | ||||
| 2. Min. Board Thickness | 2 layer | 4 layer | 6 layer | 8 layer | 10 layer | ||||
| | min. 0.2 mm | 0.4 mm | 1 mm | 1.2 mm | 1.5 mm | ||||
| | 12 & 14 layer | 16 layer | 18 layer | 20 layer | 22 & 24 layer | ||||
| | 1.6 mm | 1.7 mm | 1.8 mm | 2.2 mm | 2.6 mm | ||||
| 3. Max. Board Size | 610 x 1200 mm | | | | | ||||
| 4. Base Material | FR-4 Glass Epoxy laminate, Aluminium base, RCC | | | | | ||||
| 5. Surface Finish Treatment | Electroless nickel Immersion gold ( Electoless Ni/Au). Organic Solerability Preservatives ( OSP or Entek). Hot Air Leveling ( Lead- Free, RoHS). Carbon Ink. Peelable Mask. Gold Fingers. Immersion Silve. Immersion Tin. Flash gold ( Electrolytic) | | | | | ||||
| 6. Major Laminate | King Boad (KB-6150). ShengYi (S1141; S1170). Arion. YGA-1-1; Rogers and others. | | | | | ||||
| 7. Via Holes | Copper PTH/ Blind Via/ Buried Via/ HDI 2+N+2 with IVH | | | | | ||||
| 8. Copper Foil Thickness | 18um/ 35um/ 70um~245um (outer layer 0.5oz~7oz) 18um/ 35um/ 70um~ 210um (inner layer 0.5oz~6oz) | | | | | ||||
| 9. Min. Via Size and Type | Dia. 0.15mm (Finished). Aspect Ratiao = 12; HDI holes (<0.10mm) | | | | | ||||
| 10. Min. Line Width & Spacing | 0.75 mm/ 0.10mm ( 3mil/ 4mil) | | | | | ||||
| 11. Min Via Hole Size & Pad | Via: Dia, 0.2mm/ pad. dia. 0.4mm; HDI<0.10mm via | | | | | ||||
| 12. Impedance I Control Tol. | +/- 10% ( min. +/- 7 Ohm) | | | | | ||||
| 13. Solder Mask | Liquid Photo- Image (LPI) | | | | | ||||
| 14. Profiling | CNC Routing, V- Cutting, Punching, Push back punching, Connector chamfering | | | | | ||||
| 15. Capacity | 100 k㎡ output monthly | | | | | ||||

| Item | Capability |
| Base material | FR4,High-TG FR4,CEM3,aluminum, High Frequencey frequency(Rogers,Taconic,Aron,PTFE,F4B) |
| Layers | 1-4 Layers(Alunimum), 1-32 layers(FR4) |
| Copper Thickness | 0.5oz, 1oz, 2oz, 3oz,4oz |
| Dielectric Thickness | 0.05mm, 0.075mm, 0.1mm,0.15mm,0.2mm |
| board Core Thickness | 0.4mm,0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.5mm, 2.0mm, 3.0mm and 3.2mm |
| Board Thickness | 0.4mm - 4.0mm |
| Thickness Tolerance | +/-10% |
| Aluminum Machining | Drilling, Tapping, Milling, Routing, Die-Punching, Break-off tab available |
| Min Hole | 0.2 mm |
| Min Track Width | 0.2mm (8mil) |
| Min Track Gap | 0.2mm (8mil) |
| Min SMD Pad Pitch | 0.2mm (8mil) |
| Surface Finishing | HASL lead free,ENIG,Plated Gold,Immersion Gold,OSP |
| Solder Mask Color | Green, Blue, Black, White, Yellow, Red, Matt Green, Matt Black, Matt Blue |
| Legend Color | Black, White etc |
| Assembly Types | Surface mount Thro-hole Mixed technology (SMT & Thru-hole) Single or double sided placement Conformal coating Shield cover assembly for EMI emission control |
| Parts Procurement | Full Turnkey Partial Turnkey Kitted/Consigned |
| Component types | SMT 01005 or larger BGA 0.4mm pitch, POP (Package on Package) WLCSP 0.35mm pitch Hard metric connectors Cable & wire |
| SMT Parts Presentation | Bulk Cut tape Partial reel Reel Tube Tray |
| Stencils | Laser-cut stainless steel |
| Other Techniques | Free DFM Review Box Build Assembly 100% AOI test and X-ray test for BGA IC programming Components cost-down Function test as custom Protection technology |














| | Sample Lead time | Mass production lead time | ||
| Single sided PCB | 1~3 days | 4~7 days | ||
| Double sided PCB | 2~5 days | 7~10 days | ||
| Multilayer PCB | 7~8 days | 10~15 days | ||
| PCB Assembly | 8~15 days | 2~4 weeks | ||
| Delivery time | 3-7 days | 3-7 days | ||
| Package: Anti-static Package with carton | | | ||

|
|
Double Sided Consumer Electronics PCBA Devices motherboard PCBA Services Images |